10月29日学术报告会

题目：Analog/Mixed-Signal and RF Integrated Circuit Technologies for Wireless Communications

报告人：赵彬博士，美国Skyworks Solutions公司

时间：10月29日（星期五）下午4:00

地点：微电子所大楼308室

摘要：Wireless communications have been impacting our daily life in many ways. Analog/mixed-signal and radio frequency (RF) integrated circuits (IC) are key enabling components for wireless communications and their advancements continue to push the growth of related semiconductor market. The circuit and technology requirements for analog/mixed-signal and RF IC in wireless communications are quite different from those for digital logic and memory IC. The requirements vary dramatically for different wireless communication applications and often are in conflict with each other due to device, technology, and circuit limitations. This talk will review the development and generation of the first international roadmap of analog/mixed-signal and RF IC technologies for wireless communications and highlights the current and future challenges and opportunities.

简历：Dr. Zhao received the B.S.E.E. degree from Tsinghua University, China, in 1985, the M.S. and the Ph.D. degrees from California Institute of Technology, Pasadena, CA, in 1988 and 1993, respectively. He was with SEMATECH, Austin, TX, 1993-1996; Rockwell International Corporation, Newport Beach, CA, 1996-1998; Conexant Systems, Newport Beach, CA, 1999-2002; and Skyworks Solutions, Irvine, CA, since 2002. Currently, he is an Engineering Manager at Skyworks, responsible for analog/mixed-signal IC design and product development for wireless communication applications. His research and development activities have covered very broad areas including semiconductor lasers, DWDM communications, VLSI technologies, and IC circuit design. He has authored and coauthored about 200 journal publications and conference presentations, has written 3 book chapters, and holds 36 issued US patents. Dr. Zhao has served on a variety of IEEE conference committees, including the International Electron Device Meeting, the IEEE Symposium on VLSI Technology, and the IEEE Symposium on VLSI Circuits. He served as Chairman, Symposium on Advances in Interconnect and Packaging Materials, TMS, 2000; Chair, Subcommittee of Integrated Circuits and Manufacturing, IEDM, 2001; Co-Chair, Technical Working Group of RF and Analog/Mixed-Signal IC Technologies for Wireless Communications, the International Technology Roadmap for Semiconductors (ITRS), 2003-2004; Co-Chair, ICSICT Organizing Committee, 2001 and 2004; Guest Editor, the TMS/IEEE Journal of Electronic Materials, 2001; Guest Editor, the IEEE Transactions on Electron Devices, 2004. He currently serves as the Chair of IEEE/EDS VLSI Technology and Circuits Committee and is an Associate Editor for the IEEE Transactions on Circuits and Systems II.

届时还将举行聘请赵彬博士为清华大学信息学院客座教授仪式

欢迎师生参加。